5G Communications Applications
The copper products and high-performance alloys from HSMetal that serve critical functions across the 5G communications infrastructure ecosystem which provides material solutions across the entire 5G communications value chain Leveraging their exceptional combination of high electrical conductivity, mechanical strength, thermal management capability, and signal integrity, these materials are engineered to meet the requirements of 5G base stations, high-speed connectors,lead frames and RF filters, antenna systems, and high-frequency circuit boards.
Core Applications and Recommended Grades
|
Product Category |
Key 5G Applications |
Specific Grades / Brands |
|
Cu-Ni-Si Alloys |
High-frequency connectors, lead frames, RF shielding, high-end elastic components |
UNS: C70250, C70260, C70265, C70350, C19010, C19020, C19025 |
|
Cu-Cr-Zr Alloys |
Lead frames, 5G base station power connectors, chip packaging |
UNS/ASTM: C18150, C18200, C15000, C18100 |
|
HVLP Copper Foil |
5G RF antennas, base stations, servers, high-frequency circuit boards |
HVLP-1 (Rz 1.5-2.0μm), HVLP-2 (Rz 1.0-1.5μm), HVLP-3 (Rz ≤1.1μm), HVLP-4, HVLP-5+; HVP31 (HVLP3 for PPO); HVLP-HF4 |
|
High-Frequency Copper Foil |
5G base stations, automotive radar, flexible copper-clad laminates |
Grades typically classified by surface profile (Rz) and application frequency; specific brand grades vary by manufacturer |
|
TU0 Oxygen-Free Copper |
RF filters, resonant cavities, waveguide components |
Chinese GB/T: TU0 (Cu+Ag ≥99.99%); ASTM: C10100 (oxygen ≤5ppm); Related: TU1 (C1020) |
