C10200 Oxygen Free Copper

C10200 is a high-purity oxygen-free copper (OFC) known for its excellent electrical and thermal conductivity and resistance to hydrogen embrittlement. It is an ASTM standard grade, with the corresponding Chinese grade being TU1.

 

C10200 copper alloy has become an important material in the fields of electronics, electrical, thermal conductivity, and vacuum equipment due to its high purity, excellent conductivity and thermal conductivity, as well as outstanding processing performance. The characteristics of oxygen free copper ensure its stable operation in environments with high temperature and purity requirements, making it one of the irreplaceable materials in various high-end applications

 

 

C10200 is an oxygen free copper (OFC) grade in the American ASTM standard, belonging to Grade 2 of the oxygen free copper series. Its core features are extremely low oxygen content and high purity. This material does not use metal or non-metal deoxidizers during the melting process, but directly removes oxygen from the copper liquid through special processes such as vacuum melting or inert gas protection melting, thereby obtaining a pure copper matrix.

• Chinese GB standard: TU1 (No.1 oxygen free copper)
• Japanese JIS standard: C1020
• European EN standard: CW008A
• German DIN standard: Cu OF (2.0040)

 

The chemical composition of C10200 is extremely pure: the copper content (Cu+Ag) is ≥ 99.95%, the oxygen content is strictly controlled at an extremely low level, usually ≤ 0.001% (i.e. 10ppm), and the total impurity content does not exceed 0.05%. According to the level of oxygen content, the Chinese national standard further divides oxygen free copper into three grades: TU0, TU1, and TU2.

• TU0 has the highest purity (oxygen ≤ 0.0003%), corresponding to the American standard C10100;
• TU1 (oxygen ≤ 0.0005%), corresponding to American standard C10200;
• TU2 (oxygen ≤ 0.0010%) belongs to standard oxygen free copper.

 

International similar materials include C1020 from Japan and CW008A from the European Union, which have similar performance but different standard systems. TU2 in China often follows the GB/T 5231-2012 standard, which fully corresponds to C10200.

 

 

The main component of C10200 copper alloy is copper, and the copper content is extremely high, usually above 99.95%. Due to the high purity of this copper alloy, it has excellent conductivity and thermal conductivity.

• Copper (Cu): ≥ 99.95%
• Oxygen (O): ≤ 0.001%

Total amount of other impurities: ≤ 0.05% (including trace elements such as silver, iron, lead, etc.)
Its ultra-low oxygen content is achieved through vacuum melting or electrolytic refining processes, avoiding the brittleness and performance degradation caused by oxidation of traditional copper materials.

 

 

Physical Properties

C10200 has excellent cold and hot working performance, making it easy to perform forming processes such as rolling, stretching, forging, etc. Due to its high purity and absence of brittle oxide inclusions, it can be drawn into extremely fine filaments (micrometer sized) or rolled into extremely thin foils without easily breaking during processing. The elongation rate can reach over 30%~50%, the annealed tensile strength is about 195-250 MPa, and the hard state can reach 300-400 MPa.

• Conductivity: At room temperature, the conductivity is ≥ 101% IACS (International Annealed Copper Standard), which is close to the theoretical limit of pure copper and is an ideal material for power transmission.
• Thermal conductivity: Thermal conductivity ≥ 391 W/(m · K), suitable for heat dissipation components.

 Mechanical Properties

• Annealing tensile strength: 200-250 MPa
• Elongation rate: ≥ 45% (excellent cold working performance)
• Hardness: 40-45 HV (can be further hardened by cold work)

 

C10200 copper alloy has excellent processing performance and is suitable for various processing methods such as cold rolling, hot rolling, drawing, and extrusion. Due to its high purity and oxygen free properties, it is not easy to produce cracks and oxide layers during the processing. In addition, C10200 also has good weldability and coating properties.

• Processing performance: C10200 has excellent cold and hot processing performance, suitable for various cold and hot processing techniques. It can be processed into various forms such as rods, pipes, plates, strips, wires, etc.
• Welding: Has good welding and brazing performance. Low oxygen content avoids the risk of "hydrogen disease" during welding, and the weld seam is firm and has good conductivity. It is not recommended to perform high-temperature welding in a hydrogen containing atmosphere.
• Heat treatment: Annealing can eliminate work hardening. Attention should be paid to avoiding high temperature heating in a hydrogen containing atmosphere. Although there is no risk of hydrogen disease, hydrogen will dissolve in copper at high temperatures, and pores may form during cooling.
• Cutting processing: Pure copper is soft, sticky, and has poor cutting performance. It is easy to stick to the tool during cutting, requiring sharp tools and appropriate cutting fluid.

 

• High conductivity: C10200 copper alloy has extremely high conductivity, reaching 100% IACS (International Annealed Copper Standard), and is widely used in the electrical and electronic industries.
• High thermal conductivity: Due to its excellent thermal conductivity, C10200 is widely used in fields that require efficient heat conduction, such as radiators, heat exchangers, etc.
• Oxygen free properties: C10200 belongs to oxygen free copper, so it is not easy to form oxides under high temperature conditions, ensuring the purity and performance stability of the material.
• Excellent processing performance: This alloy has good plasticity and ductility, suitable for cold and hot processing, making it excellent in the manufacture of various complex shapes.

 

• The booming development of electric vehicles: The demand for highly conductive copper wire bundles in electric vehicles has significantly increased, driving investment in high-quality oxygen free copper materials.
• 5G infrastructure construction: The widespread deployment of 5G communication equipment has driven the demand for high-performance oxygen free copper in the telecommunications field.
• Consumer electronics miniaturization: The trend towards miniaturization of electronic products requires higher purity copper materials to maintain performance and efficiency on a smaller scale.
• Renewable energy expansion: The demand for efficient electrical components in green energy projects such as solar and wind energy continues to grow.
• The growth of China's oxygen free copper market is particularly prominent. With the acceleration of localization and the improvement of manufacturing technology, the domestic oxygen free copper industry is developing towards higher purity, better performance, and more stable quality, and is expected to occupy a more important position in the global market.

 

There are increasing procurement resources for C10200 oxygen free copper materials in both domestic and international markets. When making a purchase, it is recommended to pay attention to the following points:

• Brand confirmation: C10200 corresponds to the national standard TU1. If higher purity (above 99.99%) is required, corresponding American standard C10100 or national standard TU0/TU00 can be selected.
• Quality certification: Priority should be given to factories that can supply materials in accordance with international/national standards such as ASTM B170 and GB/T 5231, ensuring that the oxygen and impurity content of the materials meet the requirements.
• Product form: Select different forms such as bar, plate, strip, pipe, wire, etc. according to specific processing requirements. The thickness of C10200 oxygen free copper strip can be as thin as 0.08mm, meeting the requirements of precision manufacturing.
• Choose products with stable supply capability, ensuring batch stability of materials, and after-sales support.

 

 

 

Due to its excellent physical, chemical, and mechanical properties, C10200 copper alloy is widely used in the following fields:

• Electronics and electrical industry: used for manufacturing high conductivity cables, wires, contacts, and printed circuit boards.
• Thermal conduction equipment: used for manufacturing heat sinks, heat exchangers, and other devices that require efficient thermal conduction.
• Aerospace industry: In some high-precision and high reliability applications, C10200 is used to manufacture key components with high conductivity and thermal conductivity.
• Vacuum equipment: Due to its oxygen free properties, C10200 is commonly used to manufacture high-purity copper components in vacuum equipment, ensuring that oxidation does not occur under vacuum conditions.

 

Q1: What is C10200 Oxygen Free Copper?

A: C10200 is a high-purity copper grade defined by the ASTM standard, characterized by extremely low oxygen content (typically ≤0.001% or 10 ppm). It is often referred to as OFC (Oxygen Free Copper) or OFHC (Oxygen Free High Conductivity Copper).

 

Q2: What is the electrical conductivity of C10200?

A: C10200 achieves 101% IACS (International Annealed Copper Standard) at 20°C.

 

Q3: Can C10200 be welded or brazed?

A: Yes, but with important considerations specific to this material.

 

Q4: Is C10200 suitable for seawater or corrosive environments?

A: C10200 offers good to excellent corrosion resistance in many environments.

 

Q5: What is the workability of C10200?

A: C10200 offers excellent hot and cold workability.

 

Q6: Why is C10200 used in vacuum applications?

A: C10200 is preferred for vacuum applications for two primary reasons: Low outgassing and No hydrogen embrittlement.

 

Q7: Does oxygen-free copper make a noticeable difference in audio applications?

A: Yes, for high-end audio applications, C10200 and other oxygen-free copper grades are preferred.

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