HSMetal High-Performance Materials – AI Computing Power Applications
HSMetal manufactures a comprehensive range of high-performance alloys, copper alloys, titanium alloys, copper foil, and carbon-coated foils that serve critical functions across the AI computing infrastructure ecosystem. Leveraging their exceptional combination of high electrical conductivity, thermal management capability, signal integrity, and mechanical reliability, these materials are engineered to meet the most demanding requirements of AI servers, data centers, high-speed interconnects, and next-generation computing hardware.
Core Applications and Recommended Grades
|
Material Category |
Key AI Computing Applications |
Recommended Grades |
|
Copper Alloys – High-Strength |
High-speed connectors, CPU sockets, I/O connectors, optical module housings |
C19920,C70318 C194, C7025, Copper-Nickel-Silicon, Copper-Chromium-Zirconium |
|
Copper Alloys – Thermal |
Liquid cooling plates, VC materials, heat sinks, copper-graphite composites |
GB300 liquid cooling plate materials, VC materials, copper-graphite composites |
|
Copper Alloys – Power |
Busbars, power distribution, high-conductivity copper busbars |
High-conductivity copper alloys |
|
Titanium Alloys |
Chip heat dissipation components, shell protection, EMI shielding |
Titanium alloys (Grades 1-5), Ti-6Al-4V |
|
Copper Foil – High-End PCB |
AI server PCBs, high-frequency signal transmission, advanced packaging |
HVLP, RTF, Carrier copper foil |
|
Carbon-Coated Foil |
Data center backup power (battery current collectors), FFC interconnects |
Carbon-coated aluminum foil, carbon-coated copper foil |
