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Rolled Annealed Copper Foil
Rolled Annealed Copper Foil (RA Copper foil) is a high-purity copper foil manufactured through a mechanical rolling and annealing process, widely used as a conductive material in flexible printed circuits (FPCs) and other electronic applications
Description
Rolled annealed copper foil is a thin, flexible sheet of copper that has been processed through rolling and annealing to achieve specific mechanical and electrical properties. It is widely used in industries such as electronics, telecommunications, and energy due to its excellent conductivity, flexibility, and durability.
Rolled Annealed Copper Foil primarily enhances its crystallinity and lattice defect state through the alternating processes of heating and cooling, thereby improving the overall properties of the metal material. Typically, the foil is heated to temperatures ranging from 650°C to 800°C, held at this temperature for a specific duration, and then cooled using appropriate methods. This annealing process effectively eliminates structural defects, increases grain size, and enhances the plasticity and mechanical properties of the copper foil, making it more suitable for demanding applications. Below is a detailed overview of rolled annealed copper foil, including its manufacturing process, properties, and applications.
TDS of Annealed Copper Foil
| Thickness | 0.10/0.012/0.018/0.025/0.035mm | Width | ≤520mm | ||||
| Item | Unit |
Parameter |
|||||
| Thickness | MM | 0.010 | 0.012 | 0.018 | 0.025 | 0.035 | |
| Grade | - | C1100 | C1100 | C1100 | C1100 | C1100 | |
|
Copper content |
% | ≥99.95 | ≥99.95 | ≥99.95 | ≥99.95 | ≥99.95 | |
| Area Weight | g/m2 | 89±3 | 107±4 | 160±5 | 222±7 | 305±10 | |
| Roughness | (RA) | Um | ≤0.15 | ≤0.15 | ≤0.15 | ≤0.15 | ≤0.15 |
| (RZ) | Um | ≤1.7 | ≤1.7 | ≤1.7 | ≤1.7 | ≤1.7 | |
|
Tensile Strength(MP) |
State normal | Mpa | ≥360 | ≥380 | ≥400 | ≥400 | ≥400 |
| State temper (180℃) | Mpa | ≥160 | ≥160 | ≥160 | ≥160 | ≥160 | |
|
Elongation(%) |
State normal | % | ≥1.0 | ≥1.2 | ≥1.4 | ≥1.4 | ≥1.4 |
| state temper l(180℃) | % | ≥7 | ≥8 | ≥10 | ≥10 | ≥10 | |
| MIT | State normal | Time | ≥2400 | ≥2400 | ≥2400 | ≥2400 | ≥2400 |
| state temper (180℃) | Time | ≥2400 | ≥2400 | ≥2400 | ≥2400 | ≥2400 | |
| Peel strength | N/mm | ≥0.8 | ≥1.0 | ≥1.3 | ≥1.35 | ≥1.4 | |
| High temperature oxidation resistance(180℃ 1hour) | - |
Qualified |
Qualified |
Qualified |
Qualified |
Qualified |
|
Mechanical Properties
|
Temper |
JIS Temper |
Tensile Strength Rm/N/mm 2 |
Elongation A50/% |
Hardness HV |
|
M |
O |
220~275 |
≥ 15 |
50~70 |
|
Y4 |
1/4H |
240~300 |
≥ 9 |
65~85 |
|
Y |
H |
330~450 |
- |
100~140 |
|
T |
EH |
380~510 |
- |
Properties of Rolled Annealed Copper Foil
- High Electrical Conductivity
Rolled annealed copper foil retains the excellent electrical conductivity of pure copper, making it ideal for electrical and electronic applications.
Thermal Conductivity
It exhibits high thermal conductivity, which is beneficial for heat dissipation in electronic devices.
- Flexibility and Ductility
The annealing process enhances the foil's flexibility, allowing it to be easily bent, folded, or shaped without cracking.
- Corrosion Resistance
Copper foil has good resistance to corrosion in various environments, though it may tarnish over time when exposed to air.
- Surface Smoothness
Rolled and annealed copper foil typically has a smooth surface, which is crucial for applications like printed circuit boards (PCBs).
- Uniform Thickness
The rolling process ensures consistent thickness across the foil, which is critical for precision applications.
Manufacturing Process
RA copper foil begins as a thick copper ingot, which is then repeatedly passed through rolling mills to reduce its thickness while undergoing intermediate annealing (heat treatment) to relieve internal stresses . This cycle of rolling and annealing continues until the desired final thickness is achieved, typically ranging from 6μm to 100μm . After rolling, the foil undergoes surface treatment to enhance adhesion and oxidation resistance
- Rolling
Copper is initially cast into thick slabs or ingots.
These slabs are then passed through a series of rolling mills to reduce their thickness to the desired foil dimensions (typically ranging from a few micrometers to several millimeters).
- Annealing
After rolling, the copper foil undergoes annealing, a heat treatment process where it is heated to a specific temperature and then slowly cooled.
Annealing relieves internal stresses, improves ductility, and enhances the foil's flexibility and workability.
- Surface Treatment
The foil may undergo additional treatments, such as cleaning, polishing, or coating, to improve surface quality and suitability for specific applications.

RA vs. ED Copper Foil Comparison
| Feature | RA Copper | ED Copper |
|---|---|---|
| Manufacturing | Mechanical rolling + annealing | Electroplating onto a drum |
| Crystal Structure | Layered / equiaxed | Columnar / pillar |
| Flexibility | High (dynamic applications) | Low (static applications) |
| Flex Cycles | >1,000,000 | ~1,000 |
| Surface | Smooth | Rough (better adhesion) |
| Cost | Higher | Lower |
| Typical Use | Moving/folding electronics | Stationary FPCs, batteries |
Customer Feedback
- The Rolled copper foil with soft temper used as a conductor in the apparel for cancer treatment research from our Indonesia customer.

- Our ED Shielding Copper Foils with High Elongation and High Tensile Strength, can be used in many areas. We can provide the specific single-matte, double-matte, and double-shiny ED Copper for the Li-ion Battery. And we can also offer 2oz to 6oz ( nominal thickness 70um to 210um) Shielded ED Copper Foils used for shielding of electric products, especially as transformer, cable, mobile phone, computer, mechanical treatment, aerospace, and industry Applications . What is more, HTE (high temperature elongation) from 1/2oz to 2oz thickness copper foil and VLP-HTE-HF( very-low-profile, high temperature elongation, and heavy ED Copper Foils, used in PCB, which the max dimension is 1295mm x 2450mm.Below is the US customer Feedback pics for the Shielding Copper Foils used in MRI Room

Test Equipment

Certificate

Applications of Rolled Annealed Copper Foil
- Electronics:Used in printed circuit boards (PCBs), flexible circuits, and electromagnetic shielding due to its conductivity and flexibility.
- Batteries:Serves as a current collector in lithium-ion and other types of batteries.
- Telecommunications:Employed in cables, connectors, and RF shielding components.
- Energy:Used in solar panels, transformers, and other energy-related devices.
- Decorative and Artistic Uses:Its malleability and aesthetic appeal make it suitable for decorative art, crafts, and architectural elements.
- Industrial Applications:Used in gaskets, seals, and thermal management systems.

Company Profile
HSMetal is a technology-driven enterprise dedicated to the design, R&D, manufacturing, and sales of advanced copper foil products. Our portfolio features a range of high-end copper foil solutions such as ultra-thin flexible lithium battery copper foil, HVLP high-frequency high-speed ultra-low profile foil, RTF reverse treated foil, ultra-thin carrier foil (peelable copper), blackened foil, buried resistance foil, and microporous copper foil.
With years of specialized experience in R&D and production of ultra-thin flexible copper foil for lithium batteries, we have built a strong track record of delivering high-performance products alongside comprehensive technical support and customized solutions to clients worldwide.
The ultra-thin electronic copper foil series developed by our company exhibits outstanding stability and reliability, making it suitable for a wide array of applications. These include multi-layer printed circuit boards (PCBs), flexible circuit boards, IC packaging substrates, 5G smartphones, servers, base stations, AI-integrated systems, automotive radar, medical devices, and aerospace technologies.
As a critical material in both the lithium battery and electronics industries, copper foil plays an essential role in enabling technological progress. We remain committed to advancing innovation through sustained R&D, continuously improving product quality, and expanding our development of lithium-ion battery materials. Our goal is to consistently provide superior customer service and contribute to the sustainable, high-quality growth of the industry.

Electrolytic Copper Foil

Microporous Copper Foil

Rolled Copper Foil

Production Line

Quality Control

R&D Capability
FAQ
Q1: What is Rolled Annealed (RA) Copper Foil?
A:Rolled Annealed copper foil, commonly referred to as RA copper foil, is a type of copper foil manufactured through a mechanical rolling and annealing process rather than electrochemical deposition
Q2:How does RA Copper Foil compare to ED (Electrodeposited) Copper Foil?
A:This is the most frequently asked question in the industry. RA and ED copper foils differ fundamentally in manufacturing method, microstructure, and performance characteristics.
Q3:Why is RA Copper Foil more flexible than ED Copper Foil?
A:The superior flexibility of RA copper foil is directly related to its unique grain structure
Q4:What are the main applications of RA Copper Foil?
A:RA copper foil is specified for applications requiring superior flexibility, smooth surface characteristics, or high reliability under dynamic stress
Q5: What info. should I let you know if i would like to get a quotation for the the Rolled copper foil?
A: The material size (Thickness*Width*Length and total Qty). If possible, it would be more better to advise the application of the product, Then we can recommend the most suitable products with details for confirmation.
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