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Beryllium Copper Plate video

Beryllium Copper Plate

Beryllium copper plate is a high-performance copper alloy material, mainly composed of copper and a small amount of beryllium. It has high strength, high elasticity, fatigue resistance, and excellent electrical and thermal conductivity, while also being corrosion-resistant and non-magnetic. Beryllium copper plates are widely used in fields such as electronics, aerospace, and precision instruments, and are particularly suitable for manufacturing springs, connectors, and wear-resistant components. Its processing performance is good, and its mechanical properties can be further improved through heat treatment, making it an important industrial material.

Description

Beryllium copper plate is a high-performance alloy plate based on copper with 0.2% to 2% beryllium (Be) added. Known as the "King of Elasticity among copper alloys," it achieves a perfect combination of high strength, good electrical conductivity, non-magnetic properties, and non-sparking characteristics through unique heat treatment processes. It is one of the most outstanding copper alloy systems in terms of overall performance.

 

 

Main Grades and Chemical Composition

 

The main components of beryllium copper plate are copper (content 53.5-56.5%) and beryllium, and performance balance is achieved by precisely controlling the alloy ratio. The addition of beryllium significantly improves the tensile strength of the material (≥ 440MPa) while maintaining the conductivity and thermal conductivity of copper. The smooth and flat surface characteristics of the material are derived from the deep processing techniques used in the manufacturing process, including precise control of rolling, heat treatment, and other processes, to ensure that the material's dimensional accuracy and surface quality meet the requirements of precision scenes such as optical instruments.

 

Grade (UNS) Corresponding Standard Beryllium Content (Be) Other Alloying Elements Typical Characteristics

C17200

(Berylco 25)

ASTM B194, CuBe2 1.8–2.0% Co ≤0.3%, Co+Ni+Fe≤0.6% High strength type: up to 1500 MPa tensile strength, 420 HV hardness
C17000 ASTM B194 1.7% - Similar to C17200, slightly lower Be content

C17510

(Berylco 14)

CuNi2Be 0.2–0.6% Ni 1.8–2.2% High conductivity type: >45% IACS conductivity, up to 970 MPa strength
C17300 CuBe2-Pb 1.8–2.0% Pb 0.2-0.6% Free-machining type: lead added for improved machinability

 

Technical principles and processing methods


The performance realization of beryllium copper plate depends on the synergistic effect of alloying design and heat treatment process. During the casting stage, vacuum melting technology is used to reduce impurity content and improve material purity; The subsequent solid solution treatment and aging treatment further strengthen the mechanical properties by regulating the grain structure.

 

Processing services support deep processing needs, such as customizing multiple specifications (thickness and width can be adjusted as needed) according to user requirements, and ensuring weight accuracy through weighing methods. Its customizability is reflected in the flexibility of the entire process from sheet size to surface treatment, meeting the differentiated needs of different industrial scenarios.

 

Product Processing Flow

Key points of production process


Melting and Casting

  • Vacuum melting: Beryllium element is volatile and toxic, and needs to be melted in a vacuum furnace to prevent beryllium oxide dust pollution.
  • Intermediate alloy method: Beryllium copper intermediate alloy (containing 4% beryllium) is produced by carbon thermal reduction method, and then melted with copper to reduce the risk of direct addition of beryllium.
  • Vacuum casting: using inclined iron mold casting, no flow casting or continuous casting to reduce porosity and segregation, and improve tissue uniformity.

Heat treatment process

  • Solution treatment: After insulation at 780-820 ℃ and water quenching, a supersaturated solid solution is formed.
  • Aging treatment: Aging at 320-350 ℃ for 2-4 hours results in the precipitation of nanoscale strengthening phases (such as CoBe intermetallic compounds), with a hardness of up to HRC 43.
  • Intermediate annealing: eliminates processing stress, stabilizes dimensions, suitable for precision mold manufacturing.

 

Performance Characteristics

 

Mechanical Properties

  • High strength and elasticity: The tensile strength can reach 1100-1500 MPa, the yield strength is 1000-1100 MPa, the elastic modulus is 128-135 GPa, and the elastic hysteresis is extremely small, making it suitable for manufacturing precision springs and diaphragms.
  • High hardness and wear resistance: The hardness range is HRC 36-44, and the wear resistance is better than aluminum alloy and ordinary steel. The fatigue limit is about 450 MPa (10 ⁷ cycles), suitable for long-term cyclic load scenarios.
  • Low elongation rate: The elongation rate is only 1% -3%, and attention should be paid to the risk of brittleness during processing.

 

Physical properties

  • Conductivity and thermal conductivity: Conductivity ≥ 18% IACS, thermal conductivity 105-130 W/(m · K), some grades can reach 210-235 W/(m · K), better than stainless steel and close to pure copper.
  • Non magnetic and explosion-proof: Non magnetic, impact spark free, suitable for explosion-proof environments (such as petrochemical tools).

 

Difference Between ordinary copper 


Compared to ordinary copper materials, beryllium copper plates have achieved a performance leap through the alloying of beryllium elements. The tensile strength of ordinary copper materials is usually lower than 300MPa, while beryllium copper plates can increase their strength to over 440MPa through age hardening treatment, while maintaining the conductivity of copper (conductivity of about 20% IACS). This combination of "high strength and high conductivity" makes it irreplaceable in scenarios where mechanical loads and current transmission need to be simultaneously withstood. For example, spring like parts require both elastic deformation ability and avoidance of performance degradation caused by resistance heating.

 

Available Sizes & Dimensions

 

Supplier Maximum Dimensions Notes
HSMetal Thickness ≤2mm (plate); Block: 500×300×600mm C17510 and C17200
HSMetal Thickness ≤300mm × Width 600mm × Length 1200mm Forging + drawing process
HSMetal Thickness 0.1-10mm, customizable width Customizable per drawings

 

Test Equipments


Test Equipment

 

Application scenarios and selection criteria


The core application areas of beryllium copper plates include optical instrument components (such as frames and brackets) and spring manufacturing (such as high elasticity connectors). When selecting, special attention should be paid to the copper content and tensile strength indicators: copper content within the range of 53.5-56.5% can balance strength and conductivity, and tensile strength ≥ 440MPa ensures the stability of the material under stress.

 

In addition, surface flatness directly affects the assembly accuracy of optical components, and products processed through deep processing techniques should be prioritized. For scenarios that require fast delivery, the spot sales model can shorten the procurement cycle, while nationwide distribution services further enhance supply chain flexibility

 

Applications

FAQ

 

Q1: What are the main components of Beryllium Copper?
A: Beryllium copper, as the name suggests, is a copper alloy with copper as the matrix and beryllium as the main alloying element. Its typical beryllium content is between 0.5% and 3%, and small amounts of cobalt, nickel, or other elements may be added to optimize performance. Although the content of beryllium is not high, it plays a crucial role in the performance of the alloy

 

Q2: Does the electrical conductivity ofBeryllium Copper decrease due to processing?
A: Beryllium Copper is a high-performance copper alloy material, featuring excellent electrical conductivity, thermal conductivity, and machinability, and is widely used in electronics, machinery, energy, and other fields.

 

Q3: What surface treatments is Beryllium Copper suitable for?
A: Support silver plating, nickel plating, passivation and other processing, it is recommended to degreasing and pickling before pretreatment to improve adhesion.

 

Q4: How to distinguish Beryllium Copper from copper chromium zirconium?
A: Beryllium Copper has better cutting ability, while chromium zirconium copper (CuCrZr) focuses on high-strength wear resistance scenarios.

 

Q5: What is the corrosion resistance of Beryllium Copper?
A: Corrosion resistance in conventional industrial environment is better than pure copper, but strong acid and alkali environment is recommended to use with surface coating.

 

Q6: What parameters are required when ordering Beryllium Copper?
A: It is necessary to specify the alloy grade (such as C17200), state (hard/semi-hard), dimensional tolerance and testing standard (ASTM/GB).

 

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