Carrier Copper Foil

Product Description

 

Carrier Copper Foil is a specialized type of copper foil used primarily in the electronics industry, particularly for manufacturing high-density interconnect (HDI) printed circuit boards (PCBs), flexible printed circuits (FPCs), and lithium-ion batteries.

 

Key Features

High temperature resistance, corrosion resistance, wear resistance, lightweight to reduce costs

Environmentally friendly weight reduction, After undergoing multi brand seismic testing, it is safe and reliable

Structure: Consists of an ultra-thin layer of copper (typically 1.5–12 µm) bonded to a thicker carrier layer (often aluminum or another copper foil) for support during processing.

Purpose: The carrier provides mechanical strength during handling and etching, then is peeled away after the copper is laminated onto the substrate.

 

Product Technical Requirements

ITEM	CONDITION	UNIT	TECHNICAL REQUIREMENTS
Form name	Unbreaking carrier copper foil	-	20μm	25μm	35μm	45μm	55μm	75μm	120μm
BASIS WEIGHT	Ordinary temperature	g/m2	76.3 ±5	95.4 ±6	127.1 ±6	163.4 ±8	199.7 ±8	272.3 ±8	435.6 ±8
Tensile strength	Ordinary temperature	Kgf/mm 2	≥35
	180℃		≥18	≥17	≥16	≥15	≥14	≥13	≥10
Peel Strength	Normalcy	Kg/cm	≥0.70	≥0.80	≥0.90	≥1.20	≥1.25	≥1.30	＞1.40
	Muriatic acid	%	≤10
	Boiling water		≤10
Dyne value	Normal	-	45以上
High-temperature oxidation resistance	-	-	180℃,40min No oxidation phenomenon
Pinhole	Ordinary temperature	-	无
Mass resistivity	Ordinary temperature	Ω·g/ m2	≤0.170	≤0.170	≤0.166	≤0.162	≤0.162	≤0.162	≤0.162
Solderability	-	-	Excellent

 

NOTE:For more details see attached technical parameters.

 

Product Specifications

Normal size we can process as below (Unit:mm):

Thickness	Tolerance	THickness of Copper	Tolerance of the Width
0.20*	0.20(-0.01,+0.01)	0.0294±0.0002	(0.00,+0.5)
0.15*	0.15(-0.01,+0.01)	0.0220±0.0002	(0.00,+0.5)
0.12*	0.12(-0.01,+0.01)	0.0177±0.0002	(0.00,+0.5)
0.075*	0.075(-0.01,+0.01)	0.0111±0.0002	(0.00,+0.5)
0.055*	0.055(-0.005,+0.005)	0.0081±0.0002	(0.00,+0.5)
0.045*	0.045(-0.005,+0.005)	0.0066±0.0002	(0.00,+0.5)
0.035*	0.035(-0.005,+0.005)	0.0051±0.0002	(0.00,+0.5)
0.025*	0.025(-0.005,+0.005)	0.0045±0.0002	(0.00,+0.5)
0.020*	0.020(-0.005,+0.005)	0.0036±0.0002	(0.00,+0.5)

 

Applications

HDI PCBs – Enables fine-line circuitry in smartphones, tablets, and advanced electronics.

Flexible Circuits – Used in foldable devices, wearables, and automotive electronics.

Battery Anodes – Essential for lithium-ion batteries in EVs and consumer electronics.

 

Types of Carrier Copper Foil

Standard Carrier Copper Foil – Uses aluminum or copper as the carrier.

Double-Sided Carrier Foil – Copper is coated on both sides for more complex applications.

Ultra-Thin Copper Foil – As thin as 1–2 µm for high-precision circuits.

 

Manufacturing Process

Electrodeposition – Copper is electroplated onto the carrier.

Lamination – The foil is bonded to a dielectric substrate (e.g., polyimide for flex PCBs).

Carrier Removal – After lamination, the carrier is peeled or chemically etched away.

 

Advantages

High composite strength, good product consistency

Precision: Allows for ultra-fine circuit patterning (down to 5 µm lines).

Flexibility: Critical for bendable electronics.

Lightweight: Ideal for portable and miniaturized devices.

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