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C1100 Copper Foil for Pcb video

C1100 Copper Foil for Pcb

C1100 Copper Foil is a high-purity, electrolytic copper foil specifically designed for printed circuit board (PCB) applications. With a copper content of 99.9%, C1100 offers exceptional electrical conductivity, thermal conductivity, and flexibility, making it an ideal choice for manufacturing high-performance PCBs. Its superior surface quality and uniformity ensure reliable performance in electronic devices.

Description

We offer high-quality Electrolytic Deposition (ED) copper foil for PCBs, with a nominal thickness range of 8 μm to 210 μm and widths from 250 mm to 1340 mm. Our C1100 Copper Foil meets the stringent Grade II and III requirements of the international IPC-4562 standard, ensuring exceptional performance in terms of normal temperature storage, high-temperature oxidation resistance, and high-temperature elongation.

This high-precision copper foil is specifically designed to meet the demands of advanced PCB applications, including multilayer boards, flexible copper-clad laminates (FCCL), fine-line circuits, and high-frequency, high-speed substrates. Its superior properties make it an ideal choice for cutting-edge electronic devices that require reliability, durability, and precision.

 

 

Features

 

  • High Electrical Conductivity

C1100 Copper Foil provides excellent electrical conductivity, ensuring efficient signal transmission in PCBs.

  • Superior Thermal Conductivity

Efficiently dissipates heat, enhancing the thermal management of electronic components.

  • High Purity (99.9% Copper)

Minimizes impurities, ensuring consistent performance and reliability in PCB applications.

  • Excellent Flexibility and Formability

Can be easily laminated, etched, and processed into intricate PCB designs.

  • Smooth Surface Finish

Provides a uniform surface for precise etching and deposition processes.

  • Corrosion Resistance

Resists oxidation and corrosion, ensuring long-term durability in electronic devices.

 

HTE ED Copper foil Characteristics

 

Quality Items

Product Standard Thickness

12μm

15μm

18μm

22μm

25μm

35μm

50μm

70μm

105μm

Area Weigth(g/cm2)

102-110

128-130

138-153

185-195

220-230

275-290

420-440

570-580

870±45

Tensile Strength
(kg/mm2)

Room Temperature

≥30

≥30

≥30

≥30

≥30

≥30

≥28

≥28

≥28

High Temperature

≥17

≥20

≥20

≥20

≥20

≥20

≥18

≥18

≥17

Elongation
(%)

Room Temperature

≥3

≥3

≥3

≥5

≥5

≥5

≥10

≥10

≥10

High Temperature

≥2.0

≥2.5

≥2.5

≥2.5

≥2.5

≥2.5

≥5

≥5

≥5

Surface Roughness
(μm)

Shiny Surface Ra

≤0.43

≤0.43

≤0.43

≤0.43

≤0.43

≤0.43

≤0.43

≤0.43

≤0.43

Matte Surface Rz

≤5

≤6

≤6

≤10

≤10

≤10

≤12

≤12

≤13

Peel Strength
(kg/cm)

kg/cm

≥1.2

≥1.4

≥1.4

≥1.7

≥1.7

≥1.8

≥2.0

≥2.1

≥2.3

ib/in

≥6.7

≥7.8

≥7.8

≥10

≥10

≥10

≥12

≥12

≥13

Leaking Points (Point/m2)

Non

High Temperature Oxidation Resistance

Treatment at a constant temperature of 200 ℃ for 30 minutes without oxidation

 

Note: 1,The Rz value of the surface roughness is the tested stable value,not the guarantee value.

The peel strength is the test value of the standard FR-4 plate.( 140℃/5 pieces of the 7628PP)

 

8-9μmCopper foil Characteristics

 

Quality Items

Thickness

8μm

9μm

Tensile Strength
(kg/mm2)

>32

>32

Elongation
(%)

≥5

≥5

Area Weigth(g/cm2)

71±1

88±1

Shiny Surface Ra(μm)

≤0.38

≤0.38

Matte Surface Rz(μm)

≤2.0

≤2.0

Oxidation Resistance
(200℃ with 30 mins)

No color change

No color change

 

REACH TO OUR TECHNICAL TEAM

 

Available Specifications

 

Material: C1100 Electrolytic Copper (99.9% purity).

Thickness: Customizable, typically ranging from 5 µm to 70 µm.

Width: Available in standard or custom widths to meet specific requirements.

Surface Finish: Matte, shiny, or customized for specific PCB processes.

 

Test Equipment

 

Test Equipment

 

Advantages

 

Advantages of C1100 Copper Foil for PCBs
 

Advantage-1

 
Ensures high-speed signal transmission and minimal energy loss.

Advantage-2

Enhances thermal management in high-power electronic devices.

Advantage-3

Provides a smooth and uniform surface for precise PCB manufacturing.

Application-1

 

Resists corrosion, ensuring long-term reliability.  Compatible with advanced PCB fabrication techniques.

 

Certificates

 

Certificates

 

Applications

 

C1100 Copper Foil is widely used in the electronics industry for:

  • Printed Circuit Boards (PCBs): Single-sided, double-sided, and multilayer PCBs.
  • Flexible Circuits: For lightweight and bendable electronic devices.
  • RFID Antennas: High-frequency signal transmission components.
  • Battery Electrodes: Lithium-ion and other battery technologies.
  • Electromagnetic Shielding: Protecting electronic devices from interference.

product-611-323

 

 

PACKAGES

 

Copper foil Package

 

Why Choose C1100 Copper Foil for PCB?

 

C1100 Copper Foil is a trusted material for PCB manufacturing, offering unmatched electrical and thermal performance. Its high purity, flexibility, and surface quality make it an essential component in the production of reliable and high-performance electronic devices.

 

Company Profile

 

HSMetal is a technology-driven enterprise dedicated to the design, R&D, manufacturing, and sales of advanced copper foil products. Our portfolio features a range of high-end copper foil solutions such as ultra-thin flexible lithium battery copper foil, HVLP high-frequency high-speed ultra-low profile foil, RTF reverse treated foil, ultra-thin carrier foil (peelable copper), blackened foil, buried resistance foil, and microporous copper foil.

 

With years of specialized experience in R&D and production of ultra-thin flexible copper foil for lithium batteries, we have built a strong track record of delivering high-performance products alongside comprehensive technical support and customized solutions to clients worldwide.

The ultra-thin electronic copper foil series developed by our company exhibits outstanding stability and reliability, making it suitable for a wide array of applications. These include multi-layer printed circuit boards (PCBs), flexible circuit boards, IC packaging substrates, 5G smartphones, servers, base stations, AI-integrated systems, automotive radar, medical devices, and aerospace technologies.

 

As a critical material in both the lithium battery and electronics industries, copper foil plays an essential role in enabling technological progress. We remain committed to advancing innovation through sustained R&D, continuously improving product quality, and expanding our development of lithium-ion battery materials. Our goal is to consistently provide superior customer service and contribute to the sustainable, high-quality growth of the industry.

 

Electrolytic Copper Foil

Electrolytic Copper Foil

Microporous Copper Foil

Microporous Copper Foil  

Rolled Copper Foil

Rolled Copper Foil

Production Line

Production Line

Quality Control

Quality Control

R&D Capability

R&D Capability

FAQ

 

Q1: What info. should I let you know if i would like to get a quotation for the the Electrolytic copper foil?

A1: The material size (Thickness*Width*Length and total Qty). If possible, it would be more better to advise the application of the product

Then we can recommend the most suitable products with details for confirmation.

 

Q2:How long is your delivery time?

A2:Generally it is 5-10 days base on we have stock on hand. or 15-20 days if no inventory, then need check with our production team for lead time according to the quantity.

 

Q3: Do you provide samples ?

A3:Yes, if standard sizes sample is free but buyer need to pay freight cost.

 

Q4:What is your terms of payment ?

A4: Normal payment term is 30%TT, 70% before shipment get ready to ship

 

Q5: How do you guarantee the quality of the products?

A5: Each step of production and finished products will be carried out inspection by QC department before storing to the warehouse. NG products are not allowed in the completed goods warehouse.

 

 

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