Electrodeposited Copper Foil for Copper‑Clad Laminate and Printed Circuit Board (ED‑Copper Foil) is core raw material for manufacturing copper‑clad laminate (CCL), which will be further etched into conductive traces for multi‑layer printed circuit boards (PCB).
HSMetal provides IPC‑4562A compliant electrodeposited copper foil including HTE standard, RTFreverse‑treated, HVLP ultra‑low‑profile grades. Different from lithium‑ion‑battery copper foil, CCL‑grade ED copper foil goes through specialized roughening, anti‑tarnish surface treatment to guarantee stable peel‑strength during high‑temperature lamination with FR‑4, high‑Tg and high‑frequency resin substrates.
Available thickness covers 12 μm (1/3 oz), 18 μm (1/2 oz), 35 μm (1 oz) and other mainstream circuit‑grade thickness. Custom slitting service for target roll width is supported for CCL mass‑production lines. Every batch is accompanied by mill test reports, peel‑strength, surface‑roughness inspection data, RoHS & REACH compliance declaration for incoming quality audit of laminate factories.
For full‑scale material selection guidance, performance benchmark and common procurement pitfalls of electrolytic and rolled copper foil, please read our in‑depth industry knowledge article: [Article: Electrolytic vs Rolled Copper Foil: Quick Selection & Procurement Pitfall Guide].
Key Performance Features
- Strictly comply with IPC‑4562A specification for circuit‑use electrodeposited copper foil
- Stable peel strength for hot‑press lamination with various resin prepregs
- Controlled surface roughness: HTE for general FR‑4;RTF /HVLP for high‑speed low‑signal‑loss scenarios
- Good high‑temperature oxidation resistance, suitable for CCL continuous production process
- Uniform thickness distribution, few pinholes, consistent batch‑to‑batch performance
- Not interchangeable with lithium‑battery anode copper foil due to different surface treatment requirements
Available Specifications
ED copper foil for CCL and PCB
| Item | Details |
|---|---|
| Product Grade | HTE , RTF, HVLP Electrodeposited Copper Foil |
| Applicable Standard | IPC‑4562A |
| Typical Thickness | 12 μm, 18 μm, 35 μm (custom thickness upon request) |
| Form | Copper foil jumbo roll, custom‑slit roll |
| Surface Treatment | Roughening + anti‑oxidation anti‑tarnish treatment for CCL lamination |
| Main Application | FR‑4 rigid CCL, multilayer PCB inner / outer layer, AI‑server & 5G high‑speed CCL substrates |
| Inspection Items | Peel strength, surface roughness, thickness tolerance, tensile‑elongation, impurity composition analysis |
| Compliance |
RoHS, REACH |
Other specifications that are in stock year-round.
|
Quality Items |
Product Standard Thickness |
|||||||||
|
12μm |
15μm |
18μm |
22μm |
25μm |
35μm |
50μm |
70μm |
105μm |
||
|
Area Weigth(g/cm2) |
102-110 |
128-130 |
138-153 |
185-195 |
220-230 |
275-290 |
420-440 |
570-580 |
870±45 |
|
|
Tensile Strength |
Room Temperature |
≥30 |
≥30 |
≥30 |
≥30 |
≥30 |
≥30 |
≥28 |
≥28 |
≥28 |
|
High Temperature |
≥17 |
≥20 |
≥20 |
≥20 |
≥20 |
≥20 |
≥18 |
≥18 |
≥17 |
|
|
Elongation |
Room Temperature |
≥3 |
≥3 |
≥3 |
≥5 |
≥5 |
≥5 |
≥10 |
≥10 |
≥10 |
|
High Temperature |
≥2.0 |
≥2.5 |
≥2.5 |
≥2.5 |
≥2.5 |
≥2.5 |
≥5 |
≥5 |
≥5 |
|
|
Surface Roughness |
Shiny Surface Ra |
≤0.43 |
≤0.43 |
≤0.43 |
≤0.43 |
≤0.43 |
≤0.43 |
≤0.43 |
≤0.43 |
≤0.43 |
|
Matte Surface Rz |
≤5 |
≤6 |
≤6 |
≤10 |
≤10 |
≤10 |
≤12 |
≤12 |
≤13 |
|
|
Peel Strength |
kg/cm |
≥1.2 |
≥1.4 |
≥1.4 |
≥1.7 |
≥1.7 |
≥1.8 |
≥2.0 |
≥2.1 |
≥2.3 |
|
ib/in |
≥6.7 |
≥7.8 |
≥7.8 |
≥10 |
≥10 |
≥10 |
≥12 |
≥12 |
≥13 |
|
|
Leaking Points (Point/m2) |
Non |
|||||||||
|
High Temperature Oxidation Resistance |
Treatment at a constant temperature of 200 ℃ for 30 minutes without oxidation |
|||||||||
Note: 1,The Rz value of the surface roughness is the tested stable value,not the guarantee value.
The peel strength is the test value of the standard FR-4 plate.( 140℃/5 pieces of the 7628PP)
Typical Applications
Our electrolytic copper foil is widely adopted for lithium‑ion battery anode collector, rigid PCB, CCL and photovoltaic applications. However, material mis‑selection will cause unexpected yield loss.
To understand the fundamental differences between electrolytic copper foil and rolled copper foil, application boundaries and critical procurement check‑points, please refer to our industry knowledge resource:
👉 [Article: copper foil selection and procurement pitfall guide]
This guide helps R&D and procurement teams confirm:
- Whether you should consider rolled copper foil instead for dynamic‑bending requirements
- Which parameters must be written into your technical agreement
- Common substitution mistakes that lead to mass‑production scrap
Copper‑Clad Laminate (CCL)
- HTE ED copper foil: General FR‑4 / High‑Tg rigid copper‑clad laminate for consumer electronics & industrial control PCB
- RTF reverse‑treated copper foil: Multi‑layer board inner‑layer CCL, medium‑high‑speed communication substrates
- HVLP ultra‑low‑profile copper foil: High‑speed low‑loss CCL for AI server, 5G networking equipment PCB
Printed Circuit Board (PCB)
- Rigid multilayer PCB inner & outer conductive layers
- HDI high‑density interconnect circuit boards
- High‑frequency, high‑speed digital circuit substrates
Important note: PCB manufacturers do not purchase bare copper foil directly. All copper traces on finished PCB are etched from CCL laminated with electrodeposited copper foil. Lithium‑battery copper foil cannot replace CCL‑PCB circuit‑grade copper foil.
Understanding grade differences between HTE, RTF and HVLP copper foil helps you make cost‑effective material decisions for FR‑4 CCL projects. Check our full buying guide: complete buyer‑oriented guide to select copper foil for FR‑4 CCL manufacturing to match copper‑foil specifications against your end‑product requirements.
Customer Project Case - Thai CCL Manufacturer
HSMetal delivered qualified Electrodeposited Copper Foil for Copper‑Clad Laminate and Printed Circuit Board for a professional CCL manufacturer located in Thailand. This ED copper foil is used for mass‑production of standard FR‑4 copper‑clad laminate for Southeast Asian PCB downstream customers.
Client Key Requirements:
- IPC‑4562A compliant HTE ‑grade electrodeposited copper foil, stable peel‑strength for FR‑4 lamination
- Strict surface quality control: minimal pinholes, no scratch or oxidation discoloration
- Uniform thickness & batch consistency to adapt continuous CCL hot‑press production line
- Complete MTC, peel‑strength & roughness test reports for Thai‑factory incoming audit
- Suitable for sea‑transport anti‑oxidation packaging for Southeast‑Asia long‑distance shipment
HSMetal Solutions: Adopt qualified CCL‑grade ED copper foil with dedicated roughening and anti‑tarnish surface treatment. Conduct full sampling inspection for peel strength, roughness, thickness before shipment. Apply moisture‑proof & anti‑oxidation vacuum packaging for ocean freight. Deliver full‑set traceable test documentation to satisfy customer incoming quality control.
Our Collaboration
The delivered copper foil passed TLM's full incoming lab test. Stable lamination performance was verified on their FR‑4 CCL production line. No oxidation or surface‑defect issue occurred after sea transportation. The Thai client has confirmed repeat bulk orders for continuous CCL manufacturing.
With our proven copper foil technology and consistent product quality, we have established a long‑term supply partnership with Thailand CCL manufacturer. Our electrodeposited copper foil is now an integral part of Thailand client CCL production line, providing the conductive core for their FR‑4 laminates.
In actual production, our foil has demonstrated excellent lamination compatibility and electrical uniformity, contributing significantly to improved CCL yield and reliability. This successful case validates our technical capability and competitive edge in serving leading CCL manufacturers in Southeast Asia.
Product Packages In Stock
Key Product Advantages
- High‑Purity Electrodeposition Process
Manufactured from 99.9%+ pure copper feedstock, our foil is produced under strictly controlled clean‑room conditions with multi‑stage ultrafine filtration. This ensures an electrolyte free of contaminants, resulting in a dense, fine‑grained crystalline structure and superior electrical uniformity.
- Excellent Heat Resistance and High Ductility
Our copper foil exhibits exceptional thermal stability and elongation, resisting oxidation and discoloration even at elevated temperatures. The HTE (High Temperature Elongation) series achieves elongation of >3% at 180°C, fully complying with the stringent requirements of IPC‑4562 for high‑grade electrodeposited copper foil.
- Comprehensive Product Portfolio
We offer a wide thickness range – from ultra‑thin grades of 9 µm and 12 µm (ideal for advanced HDI and high‑end CCL) to standard 18 µm and 35 µm options, meeting diverse CCL and PCB needs. Our portfolio includes HTE standard foil, RTF (Reverse Treated) foil, and VLP/HVLP (Very / Hyper Low Profile) foil, tailored for high‑frequency and high‑speed applications such as AI servers, 5G communications, and automotive electronics.
- Strict Quality Assurance
All products are manufactured in full compliance with IPC‑4566 – Standard for Metal Foils for Printed Board Applications. Every batch undergoes comprehensive physical, electrical, and reliability testing to guarantee consistent, repeatable performance.
Why Choose HSMetal for Electrodeposited Copper Foil for CCL & PCB
- Manufactured to IPC‑4562A; supply HTE , RTF, HVLP grades for diverse CCL‑PCB scenarios
- Special CCL‑oriented surface treatment, guarantee stable peel‑strength during hot‑press lamination
- Custom jumbo‑roll slitting service to match customer CCL production‑line width requirement
- Strict pre‑shipment full‑range inspection; provide MTC, roughness & peel‑strength test data for factory audit
- Professional anti‑oxidation moisture‑proof ocean‑shipping packaging for Southeast‑Asia long‑haul logistics
- Proven overseas delivery experience with Thai CCL manufacturers; support prototype trial and large‑volume serial orders
On‑site Application of ED Copper Foil at Thailand Client's Production Facility
From raw copper‑foil jumbo‑roll feeding, hot‑press lamination, precision shearing to finished‑CCL inspection, our Electrodeposited Copper Foil for Copper‑Clad Laminate and Printed Circuit Board ran smoothly through every stage of Thailand Client's whole production workflow. No surface‑oxidation, poor‑adhesion or pinhole‑related issues were detected. This on‑site practical performance validated our capability as a reliable long‑term copper‑foil supplier for CCL manufacturers in Southeast‑Asia.
Multiple jumbo copper‑foil rolls are prepared for continuous mass‑production of rigid FR‑4 CCL boards.
Large jumbo rolls of our IPC‑4562A compliant electrodeposited copper foil were stored and deployed on‑site for non‑stop serial production. Thanks to our anti‑oxidation vacuum sea‑shipping packaging, the copper foil maintained flawless surface quality after long‑haul ocean transportation to Thailand, perfectly matching Thailand Client's 24‑hour continuous CCL production schedule.
Our electrodeposited copper‑foil jumbo roll is fed into Client's clean‑room lamination line for FR‑4 copper‑clad laminate manufacturing.
After arrival at Thailand Client's modern CCL production facility, our ED‑Copper Foil for Copper‑Clad Laminate and Printed Circuit Board was loaded onto their automated hot‑press laminating line within a dust‑free clean‑room workshop. Operators in full protective garments monitored the whole feeding and compound‑lamination procedure. With stable peel‑strength performance, our HTE ‑grade circuit copper foil achieved excellent bonding effect with FR‑4 resin prepreg during high‑temperature pressing.
Finished copper‑clad laminate sheets go through precision shearing after copper‑foil lamination.
Once hot‑press bonding was completed, the continuous CCL web moved to the precision‑shearing station. The laminate sheets laminated with our electrodeposited copper foil showed uniform surface, no bubbling, delamination or oxidation defects. Consistent thickness and batch‑to‑batch stability helped client avoid waste during their high‑speed cutting process.
Final‑inspected finished CCL sheets, manufactured with our circuit‑grade electrodeposited copper foil.
The final batch of FR‑4 copper‑clad laminates bonded with our ED copper‑foil passed client's strict incoming & finished‑product quality audit. These qualified CCL sheets will be supplied to downstream PCB manufacturers across Southeast‑Asia for fabricating consumer‑electronics and industrial‑control printed circuit boards. The successful on‑site operation verified that our electrodeposited copper‑foil fully satisfies long‑term mass‑production requirements for CCL plants.
About Us
HSMetal (Luoyang Hongsheng Trading Co., Ltd.) is a specialized supplier of circuit‑grade electrodeposited copper foil, high‑purity oxygen‑free copper and special metal materials for global advanced‑manufacturing industries.
We focus on Electrodeposited Copper Foil for Copper‑Clad Laminate and Printed Circuit Board, supplying HTE , RTF and HVLP grades complying with IPC‑4562A standard for CCL manufacturers. Drawing on rich practical experience serving overseas laminate factories such as Thai TLM CCL plant, we fully understand the strict requirements for peel strength, surface quality, batch‑to‑batch consistency and anti‑oxidation ocean‑transport packaging in real CCL mass‑production.
Every batch of our CCL‑grade ED copper foil undergoes full‑range pre‑shipment inspection, including peel‑strength test, surface‑roughness measurement, thickness tolerance check and visual surface examination. Complete MTC inspection reports, RoHS and REACH compliance documents are provided to support customers' incoming quality audit.
We support custom jumbo‑roll slitting, small‑batch qualification sample and large‑volume serial supply. Whether for standard FR‑4 rigid CCL, multi‑layer inner‑layer substrate or high‑speed low‑loss AI‑server substrate projects, our technical team can deliver stable, cost‑effective copper‑foil solutions for CCL and PCB‑related manufacturers across Southeast Asia, Europe and other global markets.
Our Factory
Automated continuous production line for CCLgrade electrodeposited copper foil
Finished jumbo roll of electrodeposited copper‑foil for CCL & PCB industry
Electrodeposited Copper‑Foil Clean‑room Production Workshop
Comprehensive Real‑Time Monitoring of Electrolyte Additives
Quality‑control inspection for electrodeposited copper‑foil on production‑line
High‑Precision Analysis of Copper Foil Microstructue
Quality Assurance
ROSH and REACH Certificate
Learn how electrolytic copper foil compares with rolled copper foil in performance & procurement tips → [Article: Electrolytic vs Rolled Copper Foil: Quick Selection & Procurement Pitfall Guide]
FAQ
Q1: What types of electrodeposited copper foil do you offer?
A:We offer a full portfolio of electrodeposited copper foils to meet diverse CCL and PCB requirements:
- HTE (High Temperature Elongation) – Standard high-performance foil with excellent thermal stability and ductility, suitable for general FR-4 CCL applications.
- RTF (Reversed Treated Foil) – Double-side treated foil with controlled roughness on both the matte and shiny sides, offering improved adhesion and signal performance for mid-range applications.
- VLP / HVLP (Very / Hyper Low Profile) – Ultra-smooth surface foils designed to minimize conductor loss at high frequencies, essential for AI servers, 5G infrastructure, and other high-speed digital applications.
- Thickness options range from 9 µm (ultra-thin for HDI and advanced CCL) to 35 µm and beyond, covering standard and custom specifications.
Q2:What is the difference between ED (electrodeposited) and RA (rolled annealed) copper foil?
A:ED copper foil is produced by electrodepositing copper ions onto a rotating cathode drum, resulting in a matte side (for bonding) and a shiny side. RA copper foil is mechanically rolled and annealed, offering higher ductility and bend resistance, making it flexible circuits. For rigid CCL and standard PCB applications, ED foil is the industry standard due to its cost-effectiveness, wide availability, and strong adhesion to substrate materials.
Q3: Can lithium‑ion‑battery copper foil substitute for CCL‑PCB electrodeposited copper foil?
A: No. Lithium‑battery anode copper foil uses different surface‑treatment formula and roughness design. It cannot satisfy peel‑strength, high‑temperature lamination requirements for copper‑clad laminate. Please select dedicated electrodeposited copper foil for CCL and PCB.
Q4: What core parameters should I confirm when placing an inquiry for CCL‑grade ED copper foil?
A: Please provide: copper‑foil grade (HTE / RTF / HVLP), nominal thickness(μm / oz), required jumbo‑roll width, inner‑diameter size, target peel‑strength & roughness requirement, application (FR‑4 / high‑speed substrate), order volume and destination country for shipping‑packaging suggestion.
Q5: When should I choose VLP or HVLP copper foil over standard HTE?
A:VLP and HVLP foils feature ultra-smooth surfaces that significantly reduce conductor loss at high frequencies. Choose VLP/HVLP when:
- Designing for high-frequency applications (above 1–2 GHz) such as 5G, radar, or AI servers
- Operating in low-loss or ultra-low-loss circuit environments
- Requiring tight impedance control with minimal signal degradation
For general-purpose FR-4 CCL and standard PCBs, HTE foil offers the best balance of performance and cost.
Q6: Can you customize copper foil specifications for our specific CCL formulation?
Yes. We work closely with customers to develop tailored solutions – whether adjusting surface treatment profiles, thickness tolerances, or width dimensions. Our R&D team has over 20 years of experience in copper foil metallurgy and is equipped to rapidly prototype and validate new specifications to meet your unique process requirements.
Q7:What is the shelf life and recommended storage for your copper foil?
A:Copper foil should be stored in a cool, dry environment with controlled temperature and humidity to prevent oxidation and surface contamination. We apply industry-standard anti-tarnish treatments to protect the foil surface during storage and transportation. For specific storage recommendations and shelf-life data, please refer to our product datasheets or contact our technical support team.
Q8: What test documents can you provide for CCL‑manufacturer incoming quality audit?
A: Mill Test Certificate(MTC), peel‑strength test report, surface‑roughness inspection record, thickness‑tolerance data, tensile‑elongation test data, RoHS & REACH compliance declaration. All documents follow overseas laminate‑factory audit practice, as verified by our Thai TLM CCL‑project experience.
Q9: What standards do your copper foils comply with?
A:All our products are manufactured in full compliance with IPC-4562 – the industry standard for metal foils for printed board applications. Our HTE series meets Grade 3 requirements for high-temperature elongation, with elongation values exceeding IPC specifications across all thickness grades.
Q10: How does copper foil thickness affect CCL and PCB performance?
Thickness directly impacts current-carrying capacity, impedance control, and etching resolution. Standard PCBs typically use 1 oz (35 µm) on outer layers and 0.5 oz (17.5 µm) on inner layers. Thinner foils (9–12 µm) enable finer trace geometries for HDI and advanced packaging, while thicker foils (2 oz / 70 µm and above) are used for high-current and thermal-management applications. We offer a broad thickness range to match your specific design requirements.
Q11: What is HTE copper foil and why is it important?
HTE (High Temperature Elongation) copper foil is specifically engineered to maintain ductility at elevated temperatures. This property is critical during the lamination and soldering processes, where the foil must withstand thermal stress without cracking or delaminating. Our HTE series achieves elongation of >3% at 180°C for ultra-thin grades and >10% for thicker grades, ensuring reliable performance under thermal cycling.
Q12:What packaging do you use for sea shipment to high‑humidity Southeast‑Asia markets like Thailand?
A: We adopt professional anti‑oxidation ocean‑freight package: moisture‑barrier film wrapping, desiccant, vacuum‑sealed foil bag plus reinforced outer wooden crate. This packaging effectively avoids surface oxidation and scratch during 20‑30‑day maritime transportation, which has been validated in our TLM Thailand delivery case.
Q13: What typical thickness options are available for CCL‑PCB ED copper foil?
A: Common commercial thickness:12 μm(1/3 oz),18 μm(1/2 oz),35 μm(1 oz). Other special thickness can be supported upon special project request. Thickness tolerance complies with IPC‑4562A standard.
Q14: Can you provide samples for CCL factory lab qualification? What is sample lead‑time?
A: Yes, qualification‑evaluation sample rolls are available. Please advise grade, thickness and target width. Sample preparation lead‑time: 7‑10 working days. We will send samples together with corresponding inspection datasheet for your lamination simulation test.
Q15: What is your production & delivery lead‑time for mass‑volume order?
A: If master jumbo rolls are in stock: slitting processing 3‑7 working days. For new‑production custom‑spec batches: 20‑28 working days. Exact lead‑time will be confirmed after reviewing your full technical specification.
Q16: What causes bubbling or delamination after CCL hot‑press lamination with ED copper foil?
A: Common root causes: copper‑foil surface oxidation during transportation/storage, insufficient peel‑strength, mismatched surface‑treatment with resin prepreg, abnormal lamination temperature‑pressure curve. Our technical team can offer basic troubleshooting support for laminate‑production issues after receiving your defect description.
Q17: What is the difference between RTF and HVLP copper foil for high‑speed CCL?
A: RTF (Reverse‑Treated Foil) features medium‑low roughness, cost‑effective for 5G and medium‑speed server‑CCL. HVLP (Ultra‑High‑Low‑Profile) has extremely low surface roughness, minimizing high‑frequency skin‑effect signal loss, designed for high‑end AI‑server and 112G+ high‑speed‑link substrates.
Q18: What quality control steps do you perform before copper‑foil shipment?
A: Each jumbo‑roll will go through visual surface inspection (pinhole, scratch, oxidation check), thickness‑tolerance scan across roll width, peel‑strength test, surface‑roughness measurement, tensile‑elongation test. Only rolls passing full‑item inspection will be released for packing and shipment.
Q19:What is the typical lead time and minimum order quantity (MOQ)?
A:Lead times and MOQs depend on the specific product type, thickness, and quantity. We maintain flexible production capacity to accommodate both prototype quantities and large-volume contracts. Please contact our sales team with your requirements for a tailored quotation and delivery schedule.
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