Copper Foil

Material:C11000 Copper, Cu＞99.99%. Thickness: 0.009-0.09/Max . Max Width:1300mm. Hardness:1/2hard,Hard,Soft. Feature:Excellent electrical conductivity, Thermal management effect. Application:EMI

HVLP (High Volume Low Pressure) copper foil is a specialized material widely used in industries such as electronics, printed circuit boards (PCBs), and energy storage systems. It is known for its

HTE Copper Foil, also known as High-Temperature Elongation Copper Foil, is a specialized type of copper foil designed to maintain excellent mechanical and electrical properties under high-temperature

Grade:T2,C1100. Application:Lithium Battery, PCB,Shielding. Thickness:0.005mm Min.. Width:1.0mm Min. Customzie Size Also Available. Product Type:Double Shiny, Double Matte, One Side Shiny. OEM

Grade:T2,C1100. Hardness:1/2 Hard,1/4Hard,Soft . Surface:Smooth,Bright and Clean. Tolerance±0.01-0.1mm. Feature:High Tensile Strength. Cu(Min):99.90%/Customized. Sample:Sample is available. Delivery

Copper foil is a critical material used as an anode substrate in various types of batteries, particularly lithium-ion batteries. Its excellent electrical conductivity, mechanical strength, and

In the field of lithium batteries, “anode copper foil” actually refers to the copper foil used as the negative electrode current collector. The current collector is the conductive framework that

Grade:C1100, C1020, C1220, T2, TU2, CDA110, CDA102. Thickness:0.005mm- 2.5mm. Width:1200mm max. . Coil Weight: Suggest 500kg per coil. Chemical Composition:Cu(wt.%)>99.9%,O(wt.%)0.005-0.04.

Ultra-thin copper foil is a thin sheet of copper, typically ranging from 1 micron (µm) to 10 microns in thickness.Its ultra-thin profile makes it ideal for applications requiring minimal weight and

Shielding copper foil is a functional material widely used in electronic device manufacturing, primarily for electromagnetic interference (EMI) shielding and signal integrity protection. Its core

Tin-plated copper foil is a metal composite material produced by coating a thin layer of tin onto the surface of copper foil through electroplating or electroless plating processes. Its primary

Thin Copper Foil is a versatile material known for its excellent electrical conductivity, thermal conductivity, flexibility, and corrosion resistance. It is widely used in various industries,